Journal of Material Sciences & Engineering

Muhammad Imran Khan

Publications

• Research Article
  Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth during Thermal Aging of SAC305 Solder Alloy
  Author(s): Tabassum Yasmin, Muhammad Sadiq and Muhammad Imran KhanTabassum Yasmin, Muhammad Sadiq and Muhammad Imran Khan
  
  Sn96.5Ag3Cu0.5 (SAC305) is widely used as lead-free solder for surface mount technology (SMT) card assembly and for ball-grid-array (BGA) interconnection in the microelectronic packaging industry as solder balls and pastes. In this study the effects of Lanthanum (La) doping on SAC305 under thermal aging was investigated as function of intermetallic compounds (IMCs) growth and grain size evolution. The morphology of the microstructure was analyzed under Scanning Electron Microscope (SEM) and optical microscope, the elemental distribution was confirmed by Energy Dispersive Spectroscopy (EDS) and phase identification of the crystalline structure formed during thermal aging was confirmed by x-ray diffraction (XRD). It was found that the microstructure of SAC305 solder alloy changes significantly with addition of La. Quantitative analysis of grain size and intermetallic particle size was p.. Read More»
  DOI: 10.4172/2169-0022.1000141

  Abstract PDF