Journal of Material Sciences & Engineering

Sheng-lin Yu

Publications

• Research Article
  Fining Technology of Al-50% Si Powder - A Material for Hermetically-Sealed Casing of Multichip Subsystem
  Author(s): Sheng-lin Yu, Song-bai Xue and Bang-yue YinSheng-lin Yu, Song-bai Xue and Bang-yue Yin
  
  A material for hermetically-sealed casing of multichip subsystem needs the characteristics such as high thermal conductivity, low density, low thermal expansion coefficient, automatic sealing, simplicity and convenience of subsequent application workmanship .The material that is mostly suitable to be used is Al-50% Si compound material prepared by the spray deposition method. The powder metallurgy process (PM) was studied for preparing the Al-Si compound material in this paper.The median particle size of the Al-Si powder must be less than 5μm. The ball-milling technique was adopted to reduce the particle size of Al-Si powder. The result shows: the change in ball-milling speed affects the particle size of Al-50 Si powder greatly and the increase of rotating speed can facilitate powder fining and homogenization. By determining other process parameters, it is found the ball-milling ti.. Read More»
  DOI: 10.4172/2169-0022.1000123

  Abstract PDF