Journal of Material Sciences & Engineering

Kafil Uddin Mahmood Razeeb

Kafil Uddin Mahmood Razeeb
University College Cork, Tyndall National Institute, Ireland

Biography

Dr. Kafil M. Razeeb received the B.Sc. (with honors) and M.Sc. degrees, both in Applied Physics and Electronics, from the University of Dhaka, Dhaka, Bangladesh, in 1997 and 1999, respectively, and the Ph.D. degree in physics from University of Limerick, Limerick, Ireland, in 2003. In 2003, he joined NMRC (now Tyndall National Institute) as a Post Doctoral Fellow. In 2005, he became a Research Scientist and later Staff Researcher within the Microelectronics Applications Integration group in Tyndall National Institute, Cork, Ireland. He is principal investigator of several Enterprise Ireland and EU funded projects from Tyndall and team leader of Nano-Interconnection group. Razeeb is author of over 50 technical articles and conference papers, 1 book and 6 book chapters and filed 1 patent. His current research focuses on the broad area of nanowires/ nanotubes, nanoheterostructures and nanocomposite materials, specifically on nano-sensors, nanomaterials for energy, 3D interconnection and integration techniques, nano-interconnection, thermal interface/ thermoelectric materials, electromagnetic and photocatalytic properties of novel nano-materials. Dr. Razeeb became member of IEEE in 2004 and then became senior member in 2011. He is also Chartered Physicist and Member of Institute of Physics and recipients of a Higher Education Authority, Ireland Scholarship for pursuing his Ph.D. (2000–2003). During his M.S. study (1998–1999), he received the Research Fellow award from Ministry of Science and Technology, Government of Bangladesh based on excellence in research work.

Research Interest

Fabrication of Micro and Nanostructured materials and devices for application in energy storage and production, sensor applications and power electronics, Nanowires and submicron wires for thermal management and interconnection, Processing and characterization of nanoheterostructured materials, Micro and Nano level planar and 3D integration and interconnection of Si and wafer level packaging, Thermal, electrical and thermoelectric properties of nanowires and nanotubes.