GET THE APP

Dynamic DSC curing kinetics and thermogravimetric study of epoxy resin of 9, 9'-bis (4-hydroxyphenyl) anthrone-10
..

Journal of Material Sciences & Engineering

ISSN: 2169-0022

Open Access

Dynamic DSC curing kinetics and thermogravimetric study of epoxy resin of 9, 9'-bis (4-hydroxyphenyl) anthrone-10


2nd International Conference and Exhibition on Polymer Chemistry

November 15-17, 2017 | San Antonio, USA

Jabalkumar D Thanki and Parsotam H Parsania

Marwadi University, India
Saurashtra University, India

Posters & Accepted Abstracts: J Material Sci Eng

Abstract :

Dynamic DSC curing kinetics of epoxy resin of 9,9'-bis(4-hydroxyphenyl) anthrone-10 (EAN) was carried out at 5o, 10o, 15o and 20o min-1 heating rates in nitrogen atmosphere using 4,4'-diaminodiphenyl sulfone (DDS), 4,4'-diaminodiphenyl methane (DDM) and tetrahydrophthalic anhydride (THPA) hardeners. Peak exotherms shifted towards higher temperature range with increasing heating rate. DSC data were analyzed by Ozawa, Kissinger and Flynn-Wall-Ozawa methods to derive activation energy (Ea) and frequency factor (A). Observed trend in Ea and A is EAN-DDS > EAN > EAN-THPA > EAN-DDM. For EAN-amine systems both Ea and A decreased with increasing conversion and for EAN-THPA they increased up to 30% conversion and then decreased slowly with increasing conversion. Friedman plots showed autocatalytic nature of the EAN-hardener systems. Autocatalytic nature is due to dehydration of secondary alcohol groups with simultaneous formation of allylic double bonds. Thermogravimatric study at 10oC min-1 heating rate in nitrogen atmosphere revealed that cured resins (3100c-3370c) are more thermally stable than thermally cured EAN (2790c) and followed either one or two step degradation kinetics.

Google Scholar citation report
Citations: 3677

Journal of Material Sciences & Engineering received 3677 citations as per Google Scholar report

Journal of Material Sciences & Engineering peer review process verified at publons

Indexed In

 
arrow_upward arrow_upward