GET THE APP

Localized electrochemical generation of Cu and Au metallic microstructure on doped- silica surface by SECM
..

Journal of Material Sciences & Engineering

ISSN: 2169-0022

Open Access

Localized electrochemical generation of Cu and Au metallic microstructure on doped- silica surface by SECM


International Conference and Exhibition on Materials Chemistry

March 31-April 01, 2016 Valencia, Spain

Ahmed Kandory

Univereite de Franch-Comte, France

Posters & Accepted Abstracts: J Material Sci Eng

Abstract :

Composite materials formed by copper and gold ion nanoclusters embedded in glasses were prepared via the Sol-gel method. A simple and rapid electrochemical preparation of copper and gold metallic particles is proposed using scanning electrochemical microscope (SECM). This method is not expensive and can be performed at mild conditions. The localized generation of copper and gold metallic structures on coating silica matrix has been performed by localized electro reduction of methyl vilogen and p-benzoquinon which generate reducing species which in turn diffuse towards the silica matrix and reduced the metal ions. The diameter of working electrode and electrolysis period were the main parameters and which were studied to show the effect on the size of generated dotted metallic micro patterns. The composition of the modified silica films were characterized with X-ray diffraction, SEM, optical microscope and XPS.

Biography :

Email: ahmed.kandory@univ-fcomte.fr

Google Scholar citation report
Citations: 3677

Journal of Material Sciences & Engineering received 3677 citations as per Google Scholar report

Journal of Material Sciences & Engineering peer review process verified at publons

Indexed In

 
arrow_upward arrow_upward